wires

Nanotechnology

Beyond wires: Bubble printing technology powers next-generation electronics

Laser-induced microbubbles precisely position EGaIn colloidal particles on the glass surface, forming ultrathin, conductive, and flexible interconnects. Provided by: Yokohama National University Researchers at Yokohama National University have developed a promising bubble printing method that enables high-precision patterning of liquid metal interconnects for flexible electronics. This technology provides new options for creating bendable, stretchable, and highly conductive circuits that are…