nextgeneration
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Nanotechnology
Quasiparticle research provides new insights into tellurene, paving the way for next-generation electronics
Calculated phonon polarity and band structure of few-layer tellurium and bulk tellurium. (A) Calculated A1 phonon frequency. (B) Calculated change in dipole moment due to A1 mode as a function of thickness. (C-F) Top and side views on the experimental geometry showing the calculated lattice vibrations of the A1 mode in 2L tellurium and bulk tellurium. Red arrows represent atomic…
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Space & Cosmos
NASA hopes to discover the moon with next-generation retroreflector
The Next Generation Lunar Retroreflector (NGLR-1) is one of 10 payloads scheduled to be installed on the next shipment of NASA’s Commercial Lunar Payload Services (CLPS) initiative in 2025. Equipped with retroreflectors, NGLR-1 will be delivered to the Moon. A surface that reflects very short laser pulses from the Lunar Laser Ranging Observatory on Earth. Credit: Firefly Aerospace Apollo astronauts…
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Science
Exploring imine-bonded COFs: from gas storage to next-generation electronics
Illustration of the main topics of this review. Credit: SmartMat (2024). DOI: 10.1002/smm2.1309 Recent research has spotlighted the development of covalent organic frameworks (COFs), especially imine-linked versions. Known for their tunable structures and excellent stability, imine-bonded COFs are poised to revolutionize industries from gas recovery to advanced electronics. By focusing on the design and synthesis of these materials, this study…
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Nanotechnology
Beyond wires: Bubble printing technology powers next-generation electronics
Laser-induced microbubbles precisely position EGaIn colloidal particles on the glass surface, forming ultrathin, conductive, and flexible interconnects. Provided by: Yokohama National University Researchers at Yokohama National University have developed a promising bubble printing method that enables high-precision patterning of liquid metal interconnects for flexible electronics. This technology provides new options for creating bendable, stretchable, and highly conductive circuits that are…
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Nanotechnology
Unlocking efficiency in next-generation chips: Researchers confirm thermal insights in small circuits
Microstructure of as-deposited and annealed copper films. (a–c) STEM images of as-deposited ~27 nm PVD, ~44 nm PVD-EP, and ~118 PVD films, respectively. The morphology of these films after annealing at 500 °C is shown in (d–f). The micrographs show representative areas of the as-deposited and annealed films. The grain size distributions of both the as-deposited and annealed films are…
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